Press Release

Press Release

Issuing 573rd Corporate Bonds, 574th Corporate Bonds and 575th Corporate Bonds

July 03, 2025
Chubu Electric Power Co., Inc.

Chubu Electric Power has decided to issue 573rd corporate bonds, 574th corporate bonds and 575th corporate bonds, the offering period of which has begun today.

The following is an overview of issue conditions.

Details

1 Chubu Electric Power Co., Inc. 573rd Unsecured Bonds (with pari passu clause among specified corporate bonds)

1

Amount issued

12 billion yen

2

Denominations

1 million yen

3

Coupon rate

1.842% per annum

4

Cost (Issue value)

100 yen per par value of 100 yen

5

Subscriber yield

1.842% per annum

6

Period (payback date)

9 years (July 25, 2034)

7

Payback schedule

Lump-sum payment at end of period

8

Interest disbursements

January 25 and July 25 of each year

9

Payment receipt date (Issue date)

July 9, 2025

10

Subscription accepted from

July 3, 2025

11

Subscription procedure

Public offering

12

Purpose for funds

Equipment funding, investment and loan funds, payback of loans, payback of corporate bonds, Loan funds to subsidiaries

13

Security

Unsecured

14

Bond Administrators

Sumitomo Mitsui Banking Corporation (Lead),
Mizuho Bank, Ltd.,
MUFG Bank, Ltd.

15

Underwriters

Mizuho Securities Co., Ltd.

16

Depository

Japan Securities Depository Center, Inc.

2 Chubu Electric Power Co., Inc. 574th Unsecured Bonds (with pari passu clause among specified corporate bonds)

1

Amount issued

23 billion yen

2

Denominations

1 million yen

3

Coupon rate

1.958% per annum

4

Cost (Issue value)

100 yen per par value of 100 yen

5

Subscriber yield

1.958% per annum

6

Period (payback date)

10 years (July 25, 2035)

7

Payback schedule

Lump-sum payment at end of period

8

Interest disbursements

January 25 and July 25 of each year

9

Payment receipt date (Issue date)

July 9, 2025

10

Subscription accepted from

July 3, 2025

11

Subscription procedure

Public offering

12

Purpose for funds

Equipment funding, investment and loan funds, payback of loans, payback of corporate bonds, Loan funds to subsidiaries

13

Security

Unsecured

14

Bond Administrators

Sumitomo Mitsui Banking Corporation (Lead),
Mizuho Bank, Ltd.,
MUFG Bank, Ltd.

15

Underwriters

Jointly managed by an underwriting group of four lead companies:
Mizuho Securities Co., Ltd.,
SMBC Nikko Securities Inc.,
Shinkin Securities Co.,Ltd.,
Mitsubishi UFJ Morgan Stanley Securities Co.,Ltd.

16

Depository

Japan Securities Depository Center, Inc.

3 Chubu Electric Power Co., Inc. 575th Unsecured Bonds (with pari passu clause among specified corporate bonds)

1

Amount issued

11 billion yen

2

Denominations

1 million yen

3

Coupon rate

2.732% per annum

4

Cost (Issue value)

100 yen per par value of 100 yen

5

Subscriber yield

2.732% per annum

6

Period (payback date)

20 years (July 25, 2045)

7

Payback schedule

Lump-sum payment at end of period

8

Interest disbursements

January 25 and July 25 of each year

9

Payment receipt date (Issue date)

July 9, 2025

10

Subscription accepted from

July 3, 2025

11

Subscription procedure

Public offering

12

Purpose for funds

Equipment funding, investment and loan funds, payback of loans, payback of corporate bonds, Loan funds to subsidiaries

13

Security

Unsecured

14

Bond Administrators

Sumitomo Mitsui Banking Corporation (Lead),

Mizuho Bank, Ltd.,
MUFG Bank, Ltd.

15

Underwriters

Jointly managed by an underwriting group of four lead companies:

Mitsubishi UFJ Morgan Stanley Securities Co.,Ltd.,
Nomura Securities Co.,Ltd.,
Daiwa Securities Co., Ltd.,
Mizuho Securities Co., Ltd.

16

Depository

Japan Securities Depository Center, Inc.

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