Press Release

Press Release

Chubu Electric Power Issuing 524th and 525th Corporate Bonds (Domestic Corporate Straight Bonds)

May 24, 2017
Chubu Electric Power Co.,Inc.

Chubu Electric has decided to issue 10-year  (524th issue, worth 20 billion yen) and 20-year (525th issue, worth 10 billion yen) domestic corporate straight bonds and has begun accepting applications today.

The following is an overview of issue conditions.

Details

1   524th Corporate Bonds

1. Amount issued

20 billion yen

2. Denominations

1 million yen

3. Coupon rate

0.390% annually

4. Cost (Issue value)

100 yen per par value of 100 yen

5. Subscriber yield

0.390% annually

6. Period (payback date)

10 years (May 25, 2027)

7. Payback schedule

Lump-sum payment at end of period

8. Interest disbursements

May 25 and November 25 of each year

9. Payment receipt date (Issue date)

May 31, 2017

10. Subscriptions accepted from

May 24, 2017

11. Subscription procedure

Public offering

12. Purpose of funds

Equipment funding, payback of loans, payback of corporate bonds

13. Security

Ordinary security under Electric Utility Law

14. Bond administrators

Sumitomo Mitsui Banking Corporation (Lead) , Mizuho Bank, Ltd. and Bank of Tokyo-Mitsubishi UFJ, Ltd.

15. Underwriters

An underwriting group of four companies, jointly managed by Mitsubishi UFJ Morgan Stanley Securities Co.,Ltd. Nomura Securities Co., Ltd. ,SMBC Nikko Securities Inc., and Shinkin Securities Co.,Ltd. 

16. Transfer organization

Japan Securities Depository Center, Inc.

2   525th Corporate Bonds

1. Amount issued

10 billion yen

2. Denominations

1 million yen

3. Coupon rate

0.816% annually

4. Cost (Issue value)

100 yen per par value of 100 yen

5. Subscriber yield

0.816% annually

6. Period (payback date)

20 years (May 25, 2037)

7. Payback schedule

Lump-sum payment at end of period

8. Interest disbursements

May 25 and November 25 of each year

9. Payment receipt date (Issue date)

May 31, 2017

10. Subscriptions accepted from

May 24, 2017

11. Subscription procedure

Public offering

12. Purpose of funds

Equipment funding, payback of loans, payback of corporate bonds

13. Security

Ordinary security under Electric Utility Law

14. Bond administrators

Sumitomo Mitsui Banking Corporation (Lead), Mizuho Bank, Ltd. and Bank of Tokyo-Mitsubishi UFJ, Ltd.

15. Underwriters

An underwriting group of four companies, jointly managed by Nomura Securities Co., Ltd., Mitsubishi UFJ Morgan Stanley Securities Co., Mizuho Securities Co., Ltd. and Tokai Tokyo Securities Co.,Ltd. 

16. Transfer organization

Japan Securities Depository Center, Inc.

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